Requisition Number: 8608
Posting Date: 03/Nov/09
Area of Interest: Product Engineering
Job Title: Packaging engineer
Intern/Coop/Student Term:
City/Town: Penang
State/ Province/ Region: Pulau Pinang
Country: Malaysia
Job Description: 1. Responsible for new product development & introduction
- involve in flip chip assembly process characterization & optimization
- responsible for substrate improvement
- ensure flawless execution of new product introduction
- Collaborates & frequently interface with internal & external counterparts & multifunction groups
- identified problems that relate to pro...
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