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Qualcomm-San Diego, CA, 92108, USA
Requisition # E1841526 Job Title Electrical Packaging Engineer Post Date 9/16/2009 Division QCT Job Area Engineering - Hardware Location California - San Diego Job Description Candidate will engage with IC designers and package substrate design engineers to provide electrical modeling, simulation and signal integrity recommendations for IC package development. Work will include reviewing substrate layout for signal and power routing, using electromagnetic solvers to extract parasitic values, creating SPICE models for packages and recommending layout changes to improve electrical performance...
Packaging Engineer Jobs in San Diego, California Jobs
Qualcomm | San Diego, CA, 92108, USA |
Requisition # E1841526 Job Title Electrical Packaging Engineer Post Date 9/16/2009 Division QCT Job Area Engineering - Hardware Location California - San Diego Job Description Candidate will engage with IC designers and package substrate design engineers to provide electrical modeling, simulation and signal integrity recommendations for IC package development. Work will include reviewing substrate layout for signal and power routing, using electromagnetic solvers to extract parasitic values, creating SPICE models for packages and recommending layout changes to improve electrical performance...
Qualcomm | San Diego, CA, 92108, USA | 5-7
Requisition # E1859421 Job Title Packaging Engineer - Engineer, Senior Post Date 11/3/2009 Division QCT Job Area Engineering - Hardware Location California - San Diego Job Description To manage the operations of a characterization lab supporting the assembly, test, and development of advanced IC packages. These packages are manufactured by subcontractors using both existing package technology, and advanced next generation technologies. Skills/Experience Prefer at least five to seven years of experience in the development of plastic wire-bonded or flip-chip IC packages. Working knowledge of:...
Qualcomm Jobs
Qualcomm | Shanghai, CHN | >3
Requisition # G1864662 Job Title Multimedia Software Development Engineer (Experienced) Post Date 11/18/2009 Division Qualcomm CDMA Technology Job Area Engineering - Software Location China - Shanghai Job Description . Design and develop multimedia software/firmware for wireless communication devices . Primary responsibilities o Design and develop mobile multimedia framework on Qualcomm wireless chipset o Design and implement GUI for Qualcomm wireless devices o Implement mobile multimedia applications, including camera/camcorder/video(audio) player/video telephony/video streaming/Browser/MM...
Qualcomm | Shanghai, CHN | >3
Requisition # G1864665 Job Title System Verification/Test Engineer (Experienced) Post Date 11/18/2009 Division Qualcomm CDMA Technology Job Area Engineering - Software Location China - Shanghai Job Description . Conduct system level verification and test for Qualcomm chipset based wireless devices . Primary responsibilities including: o Perform sanity, regression, functional, performance, and stability test o Conduct product/field test as needed o Analyze test results and generate test reports o Develop test plan, test cases and scripts Skills/Experience . Familiar with real-time/embedded s...
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