Electronic Packaging/Substrate Engineer
Micron Technology, Inc.-America-US-Idaho-Boise
Qualifications Successful candidates for this position will have: - 5+ years experience in packaging and substrate design using Cadence Allegro Package Design (APD), Cadence System-in-Package (SIP) design tools for the following packages: MCMCSP, USD Cards, Flip Chip in Package, and others - Demonstrated aptitude in acquiring new knowledge and technologies - The ability to work well with other technical individuals - A strong desire and commitment to do whatever is necessary to support Product Engineering - Solid personal computer skills - Excellent troubleshooting, organizational, and comm...